Research and development of three-dimensional integrated circuits.
نویسندگان
چکیده
منابع مشابه
Three-dimensional integrated circuits
integrated circuits A. W. Topol D. C. La Tulipe, Jr. L. Shi D. J. Frank K. Bernstein S. E. Steen A. Kumar G. U. Singco A. M. Young K. W. Guarini M. Ieong Three-dimensional (3D) integrated circuits (ICs), which contain multiple layers of active devices, have the potential to dramatically enhance chip performance, functionality, and device packing density. They also provide for microchip architec...
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Three-dimensional (3D), multi-transistor-layer, integrated circuits represent an important technological pursuit promising advantages in integration density, operation speed, and power consumption compared with 2D circuits. We report fully functional, 3D integrated complementary metal-oxide-semiconductor (CMOS) circuits based on separate interconnected layers of high-mobility n-type indium arse...
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ژورنال
عنوان ژورنال: SHINKU
سال: 1985
ISSN: 0559-8516,1880-9413
DOI: 10.3131/jvsj.28.8